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features ? low-voltage and standard-voltage operation ?v cc = 1.7v to 5.5v ? internally organized 25 6 x 8 (2k) ? two-wire serial interface ? schmitt trigger, filtered inputs for noise suppression ? bidirectional data transfer protocol ? 1mhz (5v), 400khz (1.7v, 2.5v, 2.7v) compatibility ? write protect pin for hardware data protection ? 8-byte page (2k) write modes ? partial page writes allowed ? self-timed write cycle (5ms max) ? high-reliability ? endurance: 1 million write cycles ? data retention: 100 years ? green (pb/halide-free/rohs compliant) package options ? die sales: wafer form and tape and reel description the atmel ? AT24C02C provides 2048-bits of serial electrically erasable and program- mable read-only memory (eeprom) organized as 256-words of 8-bits each. the device is optimized for use in many industrial and commercial applications where low- power and low-voltage operation are essential. the AT24C02C is available in space- saving 8-lead pdip, 8-lead tssop, 8-lead jedec soic, 8-lead udfn , 5-lead sot23 and 8-ball vfbga packages and is accessed via a two-wire serial interface. table 0-1. pin configuration pin name function a0 - a2 address inputs sda serial data scl serial clock input wp write protect gnd ground vcc power supply note: for use of 5-lead sot23, the software a2, a1, and a0 bits in the device address word must be set to zero to properly communicate 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 8-lead soic 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 8-lead pdip 1 2 3 5 4 scl gnd sda wp vcc 5-lead sot23 1 2 3 4 8 7 6 5 vcc wp scl sda a0 a1 a2 gnd 8-lead udfn bottom view vcc wp scl sda a0 a1 a2 gnd 1 2 3 4 8 7 6 5 8-ball vfbga bottom view 1 2 3 4 8 7 6 5 a0 a1 a2 gnd vcc wp scl sda 8-lead tssop two-wire serial electrically erasable and programmable read-only memory 2k (256 x 8) atmel AT24C02C 8700d?seepr?8/10 www.datasheet.net/ datasheet pdf - http://www..co.kr/
2 8700d?seepr?8/10 atmel AT24C02C absolute maximum ratings figure 0-1. block diagram operating temperature ........................?55 c to +125 c *notice: stresses beyond those listed under ?abso- lute maximum ratings? may cause perma- nent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. exposure to absolute maximum rating condi- tions for extended periods may affect device reliability. storage temperature ...........................?65 c to +150 c voltage on any pin with respect to ground........................... ?1.0v to +7.0v maximum operating voltage................................. 6.25v dc output current .............................................. 5.0 ma start stop logic vcc gnd wp scl sda a 2 a 1 a 0 serial control logic en h.v. pump/timing eeprom data recovery serial mux x dec d out /ack logic comp load inc data wo r d addr/counter y dec r/w d out d in load device address comparator www.datasheet.net/ datasheet pdf - http://www..co.kr/
3 8700d?seepr?8/10 atmel AT24C02C 1. pin description serial clock (scl): the scl input is used to positive edge clock data into each eeprom device and negative edge clock data out of each device. serial data (sda): the sda pin is bidirectional for serial data transfer. this pin is open-drain driven and may be wire-ored with any number of other open-drain or open-collector devices. device/page addresses (a2, a1, a0): the a2, a1 and a0 pins are device address inputs that are hard wired for the atmel ? AT24C02C. as many as eight 2k devices may be addressed on a single bus system (device addressing is discussed in detail under the device addressing section). write protect (wp): AT24C02C has a write protect pin that provides hardware data protection. the write protect pin allows normal read/write operations when connected to ground (gnd). when the write protect pin is connected to v cc , the write protection feature is enabled and operates as shown in table 1-1 . table 1-1. write protect wp pin status part of the array protected atmel 24c02c at v cc full (2k) array at gnd normal read/write operations www.datasheet.net/ datasheet pdf - http://www..co.kr/
4 8700d?seepr?8/10 atmel AT24C02C 2. memory organization atmel AT24C02C, 2k serial eeprom: internally organized with 32 pages of 8-bytes each, the 2k requires an 8-bit data word address for random word addressing. note: 1. this parameter is characterized and is not 100% tested note: 1. v il min and v ih max are reference only and are not tested table 2-1. pin capacitance (1) applicable over recommended operating range from t a =25 ? c, f = 1.0mhz, v cc = +1.7v to +5.5v symbol test condition max units conditions c i/o input/output capacitance (sda) 8 pf v i/o =0v c in input capacitance (a 0 ,a 1 ,a 2 , scl) 6 pf v in =0v table 2-2. dc characteristics applicable over recommended operating range from: t ai = ? 40 cto+85 c, v cc = +1.7v to +5.5v (unless otherwise noted) symbol parameter test condition min typ max units v cc1 supply voltage 1.7 5.5 v v cc2 supply voltage 2.5 5.5 v v cc3 supply voltage 2.7 5.5 v v cc4 supply voltage 4.5 5.5 v i cc supply current v cc = 5.0v read at 100khz 0.4 1.0 ma i cc supply current v cc = 5.0v write at 100khz 2.0 3.0 ma i sb1 standby current v cc = 1.7v v in =v cc or v ss 0.6 3.0 a i sb2 standby current v cc = 2.5v v in =v cc or v ss 1.4 4.0 a i sb3 standby current v cc = 2.7v v in =v cc or v ss 1.6 4.0 a i sb4 standby current v cc = 5.0v v in =v cc or v ss 8.0 18.0 a i li input leakage current v in =v cc or v ss 0.10 3.0 a i lo output leakage current v out =v cc or v ss 0.05 3.0 a v il input low level (1) ?0.6 v cc x 0.3 v v ih input high level (1) v cc x 0.7 v cc + 0.5 v v ol2 output low level v cc = 3.0v i ol = 2.1ma 0.4 v v ol1 output low level v cc = 1.7v i ol = 0.15ma 0.2 v www.datasheet.net/ datasheet pdf - http://www..co.kr/
5 8700d?seepr?8/10 atmel AT24C02C note: 1. this parameter is ensured by characterization only table 2-3. ac characteristics applicable over recommended operating range from t ai = ? 40 cto+85 c, v cc = +1.7v to +5.5v, cl = 1ttl gate and 100pf (unless otherwise noted) symbol parameter 1.7, 2.5, 2.7 5.0v units min max min max f scl clock frequency, scl 400 1000 khz t low clock pulse width low 1.2 0.4 s t high clock pulse width high 0.6 0.4 s t i noise suppression time 50 50 ns t aa clock low to data out valid 0.1 0.9 0.05 0.55 s t buf time the bus must be free before a new transmission can start 1.2 0.5 s t hd.sta start hold time 0.6 0.25 s t su.sta start setup time 0.6 0.25 s t hd.dat data in hold time 0 0 s t su.dat data in setup time 100 100 ns t r inputs rise time (1) 0.3 0.3 s t f inputs fall time (1) 300 100 ns t su.sto stop setup time 0.6 .25 s t dh data out hold time 50 50 ns t wr write cycle time 5 5 ms endurance (1) 5.0v, 25 ? c, byte mode 1 million write cycles www.datasheet.net/ datasheet pdf - http://www..co.kr/
6 8700d?seepr?8/10 atmel AT24C02C 3. device operation clock and data transitions: the sda pin is normally pulled high with an external device. data on the sda pin may change only during scl low time periods (see figure 5-2 on page 8 ). data changes during scl high periods will indicate a start or stop condition as defined below. start condition: a high-to-low transition of sda with scl high is a start condition which must precede any other command (see figure 5-3 on page 8 ). stop condition: a low-to-high transition of sda with scl high is a stop condition. after a read sequence, the stop command will place the eeprom in a standby power mode (see figure 5-3 on page 8 ). acknowledge: all addresses and data words are serially transmitted to and from the eeprom in 8-bit words. the eeprom sends a zero to acknowledge that it has received each word. this happens during the ninth clock cycle. standby mode: the atmel ? AT24C02C features a low-power standby mode which is enabled: (a) upon power- up and (b) after the receipt of the stop bit and the completion of any internal operations. 2-wire software reset: after an interruption in protocol, power loss or system reset, any 2-wire part can be reset by following these steps: (a) create a start bit condition, (b) clock 9 cycles, (c) create another start bit followed by stop bit condition as shown below. the device is ready for next communication after above steps have been completed. figure 3-1. software reset start bit stop bit start bit dummy clock cycles scl sda 12 3 89 www.datasheet.net/ datasheet pdf - http://www..co.kr/
7 8700d?seepr?8/10 atmel AT24C02C 4. bus timing figure 4-1. scl: serial clock, sda: serial data i/o 5. write cycle timing figure 5-1. scl: serial clock, sda: serial data i/o notes: 1. the write cycle time t wr is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle scl sda in sda out t f t high t low t low t r t aa t dh t buf t su.sto t su.dat t hd.dat t hd.sta t su.sta t wr (1) stop condition start condition wordn ack 8th bit scl sda www.datasheet.net/ datasheet pdf - http://www..co.kr/
8 8700d?seepr?8/10 atmel AT24C02C figure 5-2. data validity figure 5-3. start and stop definition figure 5-4. output acknowledge sda scl data stable data stable data change sda scl start stop scl data in data out start acknowledge 9 8 1 www.datasheet.net/ datasheet pdf - http://www..co.kr/
9 8700d?seepr?8/10 atmel AT24C02C 6. device addressing the 2k eeprom device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to figure 8-1 ). the device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. this is common to all the eeprom devices. the next three bits are the a2, a1 and a0 device address bits for the 2k eeprom. these three bits must compare to their corresponding hard-wired input pins. the eighth bit of the device address is the read/write operation select bit. a read operation is initiated if this bit is high and a write operation is initiated if this bit is low. upon a compare of the device address, the eeprom will output a zero. if a compare is not made, the chip will return to a standby state. 7. write operations byte write: a write operation requires an 8-bit data word address following the device address word and acknowledgment. upon receipt of this address, the eeprom will again respond with a zero and then clock in the first 8-bit data word. following receipt of the 8-bit data word, the eeprom will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. at this time the eeprom enters an internally timed write cycle, t wr , to the nonvolatile memory. all inputs are disabled during this write cycle and the eeprom will not respond until the write is complete (see figure 8-2 on page 10 ). page write: the 2k eeprom is capable of an 8-byte page write. a page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. instead, after the eeprom acknowledges receipt of the first data word, the microcontroller can transmit up to seven data words. the eeprom will respond with a zero after each data word received. the microcontroller must terminate the page write sequence with a stop condition (see figure 8-3 on page 10 ). the data word address lower three bits are internally incremented following the receipt of each data word. the higher data word address bits are not incremented, retaining the memory page row location. when the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. if more than eight data words are transmitted to the eeprom, the data word address will ?roll over? and previous data will be overwritten. acknowledge polling: once the internally timed write cycle has started and the eeprom inputs are disabled, acknowledge polling can be initiated. this involves sending a start condition followed by the device address word. the read/write bit is representative of the operation desired. only if the internal write cycle has completed will the eeprom respond with a zero allowing the read or write sequence to continue. 8. read operations read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. there are three read operations: current address read, random address read and sequential read. current address read: the internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. this address stays valid between operations as long as the chip power is maintained. the address ?roll over? during read is from the last byte of the last memory page to the www.datasheet.net/ datasheet pdf - http://www..co.kr/
10 8700d?seepr?8/10 atmel AT24C02C first byte of the first page. the address ?roll over? during write is from the last byte of the current page to the first byte of the same page. once the device address with the read/write select bit set to one is clocked in and acknowledged by the eeprom, the current address data word is serially clocked out. the microcontroller does not respond with an input zero but does generate a following stop condition (see figure 8-4 on page 11 ). random read: a random read requires a ?dummy? byte write sequence to load in the data word address. once the device address word and data word address are clocked in and acknowledged by the eeprom, the microcontroller must generate another start condition. t he microcontroller now initiates a current address read by sending a device address with the read/write select bit high. the eeprom acknowledges the device address and serially clocks out the data word. the microcontroller does not respond with a zero but does generate a following stop condition (see figure 8-5 on page 11 ). sequential read: sequential reads are initiated by either a current address read or a random address read. after the microcontroller receives a data word, it responds with an acknowledge. as long as the eeprom receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. when the memory address limit is reached, the data word address will ?roll over? and the sequential read will continue. the sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see figure 8-6 on page 11 ). figure 8-1. device address figure 8-2. byte write figure 8-3. page write msb lsb www.datasheet.net/ datasheet pdf - http://www..co.kr/
11 8700d?seepr?8/10 atmel AT24C02C figure 8-4. current address read figure 8-5. random read figure 8-6. sequential read www.datasheet.net/ datasheet pdf - http://www..co.kr/
12 8700d?seepr?8/10 atmel AT24C02C 9. ordering code detail atmel designator product family device density device revision shipping carrier option operating voltage 02 = 2k b or blank = bulk (tubes) t = tape and reel m = 1.7v to 5.5v package device grade or wafer/die thickness h = green, nipdau lead finish, industrial temperature range (-40?c to +85?c) u = green, matte sn lead finish, industrial temperature range (-40?c to +85?c) 11 = 11mil wafer thickness package option p = pdip ss = jedec soic x = tssop ma = udfn st = sot23 c = vfbga wwu = wafer unsawn wdt = die in tape and reel AT24C02C-sshm-b www.datasheet.net/ datasheet pdf - http://www..co.kr/
13 8700d?seepr?8/10 atmel AT24C02C 10. part markings atmel AT24C02C-pum atmel AT24C02C-sshm atmel AT24C02C-xhm | seal week | | | |---|---|---|---|---|---|---|---| a t m l u y w w |---|---|---|---|---|---|---|---| 0 2 c m @ |---|---|---|---|---|---|---|---| * lot number |---|---|---|---|---|---|---|---| | pin 1 indicator (dot) top mark seal year u = material set y = seal year ww = seal week 02c= device @ = country of assembly m = voltage indicator *lot number to use all characters in marking bottom mark no bottom mark | seal week | | | |---|---|---|---|---|---|---|---| a t m l h y w w |---|---|---|---|---|---|---|---| 0 2 c m @ |---|---|---|---|---|---|---|---| * lot number |---|---|---|---|---|---|---|---| | pin 1 indicator (dot) top mark seal year h = material set y = seal year ww = seal week 02c= device m = voltage indicator @ = country of assembly *lot number to use all characters in marking bottom mark no bottom mark pin 1 indicator (dot) | |---|---|---|---|---|---| * a t h y w w |---|---|---|---|---|---| 0 2 c m @ |---|---|---|---|---|---| atmel lot number |---|---|---|---|---|---|---| top mark h = material set y = seal year ww = seal week 02c= device m = voltage indicator @ = country of assembly bottom mark no bottom mark www.datasheet.net/ datasheet pdf - http://www..co.kr/
14 8700d?seepr?8/10 atmel AT24C02C atmel AT24C02C-mahm atmel AT24C02C-stum atmel AT24C02C-cum |---|---|---| 0 2 c |---|---|---| h m @ |---|---|---| y t c |---|---|---| * | pin 1 indicator (dot) top mark 02c= device h = material set m = voltage indicator @ = country of assembly y = year of assembly tc = trace code top mark |---|---|---|---|---| line 1 --------> 2 c m b u |---|---|---|---|---| * | pin 1 indicator (dot) bottom mark |---|---|---|---| y m t c |---|---|---|---| 2c = device m = voltage indicator b = write protection u = material set y = one digit year code m = seal month tc = trace code top mark line 1 -------> 02cu line 2 -------> ymtc | <--pin 1 this corner 02c= device u = material set y = one digit year code m = seal month tc = trace code www.datasheet.net/ datasheet pdf - http://www..co.kr/
15 8700d?seepr?8/10 atmel AT24C02C 11. ordering codes atmel AT24C02C ordering information notes: 1. ?-b? denotes bulk 2. ?-t? denotes tape and reel. soic = 4k per reel. tssop, udfn, sot23, and vfbga = 5k per reel 3. for wafer sales, please contact atmel sales ordering code voltage package operation range AT24C02C-pum (bulk form only) 1.7v to 5.5v 8p3 lead-free/halogen-free/ industrial temperature (?40 cto85 c) AT24C02C-sshm-b (1) (nipdau lead finish) 1.7v to 5.5v 8s1 AT24C02C-sshm-t (2) (nipdau lead finish) 1.7v to 5.5v 8s1 AT24C02C-xhm-b (1) (nipdau lead finish) 1.7v to 5.5v 8a2 AT24C02C-xhm-t (2) (nipdau lead finish) 1.7v to 5.5v 8a2 AT24C02C-mahm-t (2) (nipdau lead finish) 1.7v to 5.5v 8y6 AT24C02C-stum-t (2) 1.7v to 5.5v 5ts1 AT24C02C-cum-t (2) 1.7v to 5.5v 8u3-1 AT24C02C-wwu11 (3) 1.7v to 5.5v die sale industrial temperature (?40 cto85 c) package type 8p3 8-lead, 0.300" wide, plastic dual inline package (pdip) 8s1 8-lead, 0.150" wide, plastic gull wing small outline (jedec soic) 8a2 8-lead, 4.4mm body, plastic thin shrink small outline package (tssop) 8y6 8-lead, 2.00mm x 3.00mm body, 0.50mm pitch, dual no lead package (udfn) 5ts1 5-lead, 2.90mm x 1.60mm body, plastic thin shrink small outline package (sot23) 8u3-1 8-ball, die ball grid array package (vfbga) www.datasheet.net/ datasheet pdf - http://www..co.kr/
16 8700d?seepr?8/10 atmel AT24C02C 12. packaging information 8p3 ? pdip package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc notes: 1. this drawing is for general information only; refer to jedec drawing ms-001, variation ba for additional information. 2. dimensions a and l are measured with the package seated in jedec seating plane gauge gs-3. 3. d, d1 and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.010 inch. 4. e and ea measured with the leads constrained to be perpendicular to datum. 5. pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 (0.25mm). common dimensions (unit of measure = inches) symbol min nom max note d d1 e e1 e l b2 b a2 a 1 n ea c b3 4 plcs a 0.210 2 a2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 d 0.355 0.365 0.400 3 d1 0.005 3 e 0.300 0.310 0.325 4 e1 0.240 0.250 0.280 3 e 0.100 bsc ea 0.300 bsc 4 l 0.115 0.130 0.150 2 top view side view end view 8p3 c 07/19/10 8p3, 8-lead, 0.300? wide body, plastic dual in-line package (pdip) ptc www.datasheet.net/ datasheet pdf - http://www..co.kr/
17 8700d?seepr?8/10 atmel AT24C02C 8s1 ? jedec soic package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note a1 0.10 ? 0.25 a 1.35 ? 1.75 b 0.31 ? 0.51 c 0.17 ? 0.25 d 4.80 ? 5.05 e1 3.81 ? 3.99 e 5.79 ? 6.20 e 1.27 bsc l 0.40 ? 1.27 ? ? 0 ? 8 ? ? e e 1 1 n n top view t o p v i e w c c e1 e 1 end view a a b b l l a1 a 1 e e d d side view s i d e v i e w 8s1 f 5/19/10 notes: this drawing is for general information only. refer to jedec drawing ms-012, variation aa for proper dimensions, tolerances, datums, etc. 8s1, 8-lead (0.150? wide body), plastic gull wing small outline (jedec soic) swb www.datasheet.net/ datasheet pdf - http://www..co.kr/
18 8700d?seepr?8/10 atmel AT24C02C 8a2 ? tssop package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc common dimensions (unit of measure = mm) symbol min nom max note d 2.90 3.00 3.10 2, 5 e 6.40 bsc e1 4.30 4.40 4.50 3, 5 a ? ? 1.20 a2 0.80 1.00 1.05 b 0.19 ? 0.30 4 e 0.65 bsc l 0.45 0.60 0.75 l1 1.00 ref side view end view top view a2 a l l1 d 1 2 3 e1 n b pin 1 indicator this corner e e notes: 1. this drawing is for general information only. refer to jedec drawing mo-153, variation aa, for proper dimensions, tolerances, datums, etc. 2. dimension d does not include mold flash, protrusions or gate burrs. mold flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. dimension e1 does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. dambar cannot be located on the lower radius of the foot. minimum space between protrusion and adjacent lead is 0.07mm. 5. dimension d and e1 to be determined at datum plane h. 8a2 e 5/19/10 8a2, 8-lead 4.4mm body, plastic thin shrink small outline package (tssop) tnr www.datasheet.net/ datasheet pdf - http://www..co.kr/
19 8700d?seepr?8/10 atmel AT24C02C 8y6 - udfn package drawing contact: packagedrawings@atmel.com drawing no. gpc rev. title 8y6 ynz e 11/21/08 8y6 , 8-lead, 2.0x3.0mm body, 0.50mm pitch, ultrathin mini-map, dual no lead package (sawn)(udfn) common dimensions (unit of measure = mm) symbol min nom max note 1.40 ? ? 0.00 ? 0.20 0.20 d e d2 e2 a a1 a2 a3 l e b 2.00 bsc 3.00 bsc 1.50 ? ? 0.02 ? 0.20 ref 0.30 0.50 bsc 0.25 1.60 1.40 0.60 0.05 0.55 0.40 0.30 2 a2 pin 1 index area a3 d e b (8x) pin 1 id a1 a l (8x) e (6x) 1.50 ref. d2 e2 notes: 1. this drawing is for general information only. refer to jedec drawing mo-229, for proper dimensions, tolerances, datums, etc. 2. dimension b applies to metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. if the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. soldering the large thermal pad is optional, but not recommended. no electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground www.datasheet.net/ datasheet pdf - http://www..co.kr/
20 8700d?seepr?8/10 atmel AT24C02C 5ts1 ? sot23 package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc notes: 1. dimensions d does not include mold flash, protrusions or gate burrs. mold flash protrusions or gate burrs shall not exceed 0.15mm per end. dimensions e1 does not include interlead flash or protrusion. interlead flasg or protrusion shall not exceed 0.15mm per side. 2. the package top may be smaller than the package bottom. dimensions d and e1 are deteremined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. these dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 4. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.80mm total in excess of the ?b? dimension at maximum material condition. the dambar cannot be located on the lower radius of the foot. minimum space between protrusion and an adjacent lead shall not be less than 0.07mm. 5. this drawing is for general information only. refer to jedec drawing mo-193, variation ab for additional information. 5ts1 b 11/05/08 5ts1 , 5-lead, 1.60mm body, plastic thin shrink small outline package (shrink sot) tsz end view top view side view common dimensions (unit of measure = mm) symbol min nom max note ? 0.00 0.70 0.08 0.30 a a1 a2 c d e e1 l1 e e1 b ? ? 0.90 ? 2.90 bsc 2.80 bsc 1.60 bsc 0.60 ref 0.95 bsc 1.90 bsc ? 1.10 0.10 1.00 0.20 0.50 3 1, 2 1, 2 1, 2 3, 4 e1 e e1 54 2 3 1 l c c l1 a b e a2 a1 d seating plane www.datasheet.net/ datasheet pdf - http://www..co.kr/
21 8700d?seepr?8/10 atmel AT24C02C 8u3-1 ? vfbga package drawing contact: packagedrawings@atmel.com drawing no. rev. title gpc 8u3-1 d 07/14/10 8u3-1, 8-ball, 1.50 x 2.00mm body, 0.50 pitch, vfbga package (dbga2) gxu common dimensions (unit of measure - mm) symbol min nom max note a 0.73 0.79 0.85 a1 0.09 0.14 0.19 a2 0.40 0.45 0.50 b 0.20 0.25 0.30 2 d 1.50 bsc e 2.0 bsc e 0.50 bsc e1 0.25 ref d 1.00 bsc d1 0.25 ref 1. this drawing is for general information only. 2. dimension ?b? is measured at maximum solder ball diameter. 3. solder ball composition shall be 95.5sn-4.0ag-.5cu. notes: a 2 side view a pin 1 ball pad corner top view e d a 1 5. b 8 solder balls bottom view (d1) d 4 3 2 (e1) 6 e 5 7 pin 1 ball pad corner 1 8 www.datasheet.net/ datasheet pdf - http://www..co.kr/
22 8700d?seepr?8/10 atmel AT24C02C 13. revision history doc. rev. date comments 8700d 08/2010 changed AT24C02C-xhm part marking from c02cm@ to 02cm @ 8700c 07/2010 ordering information: - changed atmel AT24C02C-tsum-t to atmel AT24C02C-stum-t - changed atmel AT24C02Cy6-mahm-t to atmel AT24C02C-mahm-t - changed atmel AT24C02Cu3-cum-t to atmel AT24C02C-cum-t catalog numbering scheme, changed ts = sot23 to st = sot23 part marking sot23: - changed 2cmwu to 2cmbu - changed w = write protection feature to b = write protection part marking pdip and soic: adde d @ = country of assembly part marking tssop: replaced and removed bottom mark part marking udfn: added hm@ remove preliminary status changed t i max 40 to 50 in table ac characteristics 8700b 02/2010 corrected catalog numbering scheme and ordering information 8700a 12/2009 initial document release www.datasheet.net/ datasheet pdf - http://www..co.kr/
8700d?seepr?8/10 headquarters international atmel corporation 2325 orchard parkway san jose, ca 95131 usa tel: (+1) (408) 441-0311 fax: (+1) (408) 487-2600 www.atmel.com atmel asia limited unit 01-5 & 16, 19f bea tower, millennium city 5 418 kwun tong road kwun tong, kowloon hong kong tel: (+852) 2245-6100 fax: (+852) 2722-1369 atmel munich gmbh business campus parkring 4 d-85748 garching b. munich germany tel: (+49) 89-31970-0 fax: (+49) 89-3194621 atmel japan 9f, tonetsu shinkawa bldg. 1-24-8 shinkawa chuo-ku, tokyo 104-0033 japan tel: (+81) (3) 3523-3551 fax: (+81) (3) 3523-7581 product contact technical support s_eeprom@atmel.com sales contact www.atmel.com/contacts literature requests www.atmel.com/literature disclaimer: the information in this document is provided in connection with atmel products. no license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of atmel products. except as set forth in atmel?s terms and condi- tions of sale located on atmel?s web site, atmel assumes no liability whatsoever and disclaims any express, implied or statutory warranty relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or non-infringement. in no event shall atmel be liable for any direct, indirect, consequential, punitive, special or inciden- tal damages (including, without limitation, damages for loss of profits, business interruption, or loss of information) arising out of the use or inability to use this document, even if atmel has been advised of the possibility of such damages. atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to s pecifications and product descriptions at any time without notice. atmel does not make any commitment to update the information contained herein. unless specifica lly provided otherwise, atmel products are not suitable for, and shall not be used in, automotive applications. atmel?s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. ? 2010 atmel corporation. all rights reserved. atmel ? , logo and combinations thereof, and others, are registered trademarks or trademarks of atmel corporation or its subsidiaries. other terms and product names may be trademarks of others. www.datasheet.net/ datasheet pdf - http://www..co.kr/

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